Németország – Laboratóriumi, optikai és precíziós felszerelések (kivéve szemüvegek) – Flip Chip Die Bonder

In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.