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Hollandia – Mikroelektronikai gépek, berendezések és mikrorendszerek – Metrology SEM+FIB system

Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNOPaíses BaixosPublicado em 27 de jul. de 2026
41 dias restantes

Descrição

The main purpose of this FIB/SEM equipment is to perform material milling (cutting), 3D characterization, and cross section analysis of epitaxially grown InP, InGaAs, InAlGaAs and InGaAsP layers on InP substrates. The structures may also contain polymer-based planarization layers, SiOx or SiNx dielectric layers and TiPtAu or NiGeAu metal layers. Levering van één SEM +FIB systeem

Códigos CPV

Microelectronic machinery and apparatus and microsystemsMiscellaneous evaluation or testing instruments

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Contains data from Tenders Electronic Daily (TED), © European Union, ted.europa.eu — CC BY 4.0.

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