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Germany – Hardware – PR1148431 SOC Interkonnektor-Platten, SOC interconnects (2026)
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., IKTSGermanyPublished on Feb 09, 2026
Deadline passedDescription
Im Rahmen des Offenen Verfahrens werden 10.000 Stück SOC Interkonnektor-Platten / SOC interconnects für die Bedarfsdeckung in 2026 ausgeschrieben.
CPV codes
HardwarePlates, sheets, strip and foil related to construction materials
Documents & submission
AI summary
Sign in for an AI summaryContains data from Tenders Electronic Daily (TED), © European Union, ted.europa.eu — CC BY 4.0.
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