France – Microelectronic machinery and apparatus – Fourniture d’un équipement de 300mm de polissage mécano-chimique

For its research activities aimed at developing FD-SOI 10 nm technologies and beyond, CEA-LETI wishes to acquire a 300mm mechanical-chemical polishing equipment. The equipment must be able to polish metallic films such as copper or tungsten as well as barrier materials such as tantalum or titanium. The equipment must also be able to polish transparent plates. It must be equipped with 4 platens and 2 cleaners to be able to process 2 procedures in parallel. It must be equipped with the latest polishing heads and end-point systems allowing for the automatic adjustment of the polishing profile. The tool must subsequently integrate an in-situ metrology module. The present contract includes the following mandatory option: - Option n°1: Extension of the warranty by an additional year. The present contract includes the following optional options: - Option n°2: Supply of a residue sensor (§3.1 of the technical specifications), - Option n°3: Supply of a heat exchanger/cooler (§3.2.6 of the technical specifications), - Option n°4: Supply of an electrical transformer (§4.1.3 of the technical specifications), - Option n°5: First-level maintenance training (§9 of the technical specifications), - Option n°6: Advanced maintenance training (§9 of the technical specifications), - Option n°7: The price of transport, insurance included, according to the DAP CEA Grenoble conditions (Incoterms ICC 2020 Convention).