Spain – Electronic integrated circuits and microassemblies – Suministro, instalación y puesta en funcionamiento de un equipo Electron Beam Lithography tool up to 8-inch wafers (UPV04) y un equipo SEM (UPV13) para la Pilot Line de la UPV

The procurement subject of this tender is necessary to carry out the research and development work for the Pilot Line of the UPV, with the objective of improving the existing advanced pilot lines and developing new ones across the entire Union, to enable the development and deployment of cutting-edge semiconductor technologies and next-generation semiconductor technologies. To this end, it is necessary to proceed with the acquisition, among others, of the following equipment:

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• UPV04 - Electron beam lithography tool up to 8-inch wafers: Electron beam lithography equipment that exposes patterns in sensitive resists using a focused and scanned electron beam. It writes nanometric resolution features according to the design in a digital file. Dedicated to nanofabrication patterning, especially for masks and structures in photonics, semiconductors and nanotechnology.

• UPV13 – SEM: Surface inspection equipment using a focused electron beam that delivers nanometric resolution images. It provides morphological and surface contrast information, as well as contrast associated with differences in composition or atomic number, depending on the detectors and imaging modes available. Dedicated to metrology, process inspection and validation, and quality control.

The suitability of the equipment is based on its ability to jointly cover the dedicated patterning and metrology requirements necessary for the fabrication in the pilot line of hybrid integrated photonic circuits. This capability allows for the coordination of the definition of exposure parameters and points of interest for subsequent metrology, the integration of post-process external SEM inspection, and the assurance of the traceability and coherence of the data generated during the manufacturing flow.