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Spain – Electronic integrated circuits and microassemblies – MY26/ITEAM/S/57
Universitat Politènica de ValènciaSpainPublished on Jul 26, 2026
50 days left
SpainDescription
Supply of equipment for wafer dicing preparation for the Pilot Line of the UPV (UPV47)
CPV codes
Electronic integrated circuits and microassemblies
Documents & submission
AI summary
Sign in for an AI summaryContains data from Tenders Electronic Daily (TED), © European Union, ted.europa.eu — CC BY 4.0.
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