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Spain – Electronic integrated circuits and microassemblies – MY26/ITEAM/S/57

Universitat Politènica de ValènciaSpainPublished on Jul 26, 2026
5 days left

Description

Supply of equipment for wafer dicing preparation for the Pilot Line of the UPV (UPV47)

CPV codes

Electronic integrated circuits and microassemblies

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Contains data from Tenders Electronic Daily (TED), © European Union, ted.europa.eu — CC BY 4.0.

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