France – Electromechanical equipment – Equipement de 300mm de gravure sélective Si-SiGe - Dry selective_SiSiGe_etching tool

The CEA Leti, for its research activities aimed at developing 10nm and beyond FDSOI technologies (FDSOI10), wishes to acquire etching equipment for its clean room. The equipment will be capable of processing 300mm wafers and will allow for highly selective and isotropic etching of silicon (Si) and silicon-germanium (SiGe). It includes the following mandatory options: - Option 1: Process 7 (etching of SiCO spacer) - Option 2: Process 8 (etching of spacer and SADP) - Option 3: Level 1 Maintenance Training. As well as the cost of the optional options: - Option 4: Heat exchangers and chillers (Section 3.2.6) - Option 5: Power supply transformer (Section 4.1.4) - Option 6: Advanced Maintenance Training (Chapter 9) - Option 7: Preventive, corrective maintenance services and necessary spare parts (Section 12.2).