Spain – Microelectronic machinery and apparatus and microsystems – Suministro de sistema de grabado mediante haz iónico (Ion beam Etching - IBE)

The team will be assigned to the Singular Scientific and Technical Infrastructure (ICTS) MICRONANOFABS, the Spanish network of clean rooms for micro and nanofabrication integrated into the National Map of ICTS of the competent Ministry in matters of science. The NTC-UPV Micro and Nano Fabrication Infrastructure is part of this network, along with the National Centre for Microelectronics (CSIC) and the ISOM (UPM) Technology Centre. The installation will be located in the Clean Room of building 8F of the NTC-UPV. The Centre for Nanophotonic Technology develops fabrication processes for integrated photonic devices, biosensors, integrated optics components, quantum devices, microelectromechanical systems (MEMS), microfluidic structures and nanophotonic systems over a wide variety of materials, including silicon, silicon nitride, glass, quartz, III-V materials, dielectric materials and hybrid structures. As an ICTS integrated into the MICRONANOFABS network, the NTC-UPV provides micro and nanofabrication services to national and international research groups, as well as to companies, within the framework of competitive projects, technology transfer contracts and provision of advanced services. This condition of shared singular infrastructure obliges maintaining an updated, robust and high-performance instrumental endowment, in line with the state of the art, that allows responding to both the own research lines and the external demand of the scientific and industrial community, in line with the objectives of the PERTE Chip for the strengthening of the national capabilities of microelectronics and photonics. Many of the devices fabricated in the infrastructure require highly precise physical etching processes on materials for which conventional chemical (wet) etching processes do not provide the necessary surface quality, anisotropy or selectivity. Furthermore, the increasing complexity of the developed devices requires the availability of highly reproducible processes, with precise control of the angle of incidence of the beam, high process stability, automation and continuous monitoring.