Germany – Laboratory, optical and precision equipments (excl. glasses) – Chemisch-mechanische Poliermaschine

The Friedrich-Schiller-Universität Jena intends to acquire a chemical-mechanical polishing machine (CMP) for polishing semiconductor and dielectric surfaces for optical applications as part of its scientific activities. It must be suitable for sample sizes up to wafers (semiconductor discs) with diameters of up to 100 millimetres and be able to achieve roughness values of less than 1 nanometre (RMS roughness). This results in the following minimum requirements: see Annex 2. The contracting authority reserves the right to exclude offers with a total contract value of more than 225,000.00 euros net from evaluation. If all offers exceed this threshold, the contracting authority is entitled to cancel the tender.