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Germany – Microelectronic machinery and apparatus and microsystems – Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
Fraunhofer-Gesellschaft, Einkauf B12GermanyPublished on Nov 01, 2026
No deadline given
GermanyDescription
PR1275392-3460-W Automated 300 mm Die-to-Wafer thermocompression bonding tool
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Microelectronic machinery and apparatus and microsystems
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Sign in for an AI summaryContains data from Tenders Electronic Daily (TED), © European Union, ted.europa.eu — CC BY 4.0.
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