Germany – Laboratory, optical and precision equipments (excl. glasses) – Ätzanlage zum tiefen Silicium-Ätzen für MEMS

The Ruhr-Universität Bochum intends to procure a DRIE etching system to be used in the Microelectronics Bochum research laboratory for wafer substrates up to 200 mm in diameter. It is to be used in the field of silicon-based Micro-Electro-Mechanical Systems (MEMS) for deep anisotropic silicon etching based on a cyclic etching process (DRIE, "BOSCH process") and, in addition, to research new etching concepts that use less climate-damaging etching gases.