France – Microelectronic machinery and apparatus – Fourniture d’un équipement de dépôt dédié au remplissage métallique de vias à basse température

For its research activities, which aim to develop FDSOI 10nm technologies and beyond, CEA-Leti wishes to acquire equipment dedicated to low-temperature metal via fill for memory applications, for its clean room. The equipment will be capable of using 300mm wafers and is intended for the deposition of high-conformity thin tungsten films in vias with a high aspect ratio. The envisaged contract includes one mandatory priced option and four optional priced options:

Mandatory priced option: Option 3 (optional service): Level 1 maintenance training

Optional priced options:

Option 1 (optional supply): Heat exchangers / coolers

Option 2 (optional supply): Electrical power transformer

Option 4 (optional service): Advanced maintenance training

Option 5 (optional service): One-year warranty extension