France – Electronic, electromechanical and electrotechnical supplies – Fourniture d’un outil de mesure de couches minces compatible avec wafers de 200 mm et 300 mm

For its research activities aimed at developing 10 nm FD-SOI technologies and beyond, CEA-LETI wishes to acquire a thin film measurement tool compatible with 200 mm and 300 mm wafers, usable in a class 100 clean room. The equipment must integrate spectroscopic ellipsometry and reflectometry functions. It must ensure precise and reproducible measurements of the thicknesses and optical properties of single or stacked layers. The targeted technologies include, among others, SOI, high-k materials, GaN, SiC and III-V. The envisaged contract comprises: - a firm lot corresponding to the basic equipment, - an optional lot n°1 relating to the supply of OCD and the computer environment (OCD Module). The present contract includes the following optional items to be priced at the supplier's discretion: o OPT1: 1st Level Maintenance Training o OPT2: Advanced Maintenance Training o OPT3: Supply of an electrical transformer o OPT4: Supply of a heat exchanger/coolers o OPT5: Extension of warranty for an additional year o OPT6: The price of transport, insurance included, according to the conditions DAP CEA Grenoble (Incoterms ICC 2020).