France – Microelectronic machinery and apparatus – Acquisition d’une paillasse de gravure matériaux III-V pour le CEA de GRENOBLE

For its research activities, CEA-LETI wishes to acquire equipment, a semi-automatic chemistry bench for the etching and cleaning of III-V materials on silicon, indium phosphide (InP) or gallium arsenide (GaAs) wafers with diameters of 100, 150, 200 and 300 mm for microelectronics. This bench will replace an existing bench in the LETI clean room. Consequently, the proposed equipment must meet the following dimensions:

o Length = 2500 mm

o Depth = 1700 mm

o Height = 2100 mm

The contract also includes the following optional items to be priced at the supplier's discretion*:

o Option 1: Temperature exchangers and coolers (3.2.6);

o Option 2: Power transformers (4.1.4);

o Option 3: First-level maintenance training (9);

o Option 4: Advanced maintenance training (9);

o Option 5: One additional year of warranty extension (11.1);

o Option 6: Provision of a dry contact indicating the opening of the H2SO4 or H2SO5 drain valve (4.2.3);

o The price of transport, insurance included, according to the DAP CEA Grenoble conditions (Incoterms ICC 2020 Convention).