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Germany – Miscellaneous general and special-purpose machinery – Clustertool for Ion Beam Etching of 300mm wafers

Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.GermanyPublished on Feb 18, 2026
No deadline given

Description

The tender item is an ion beam etching process tool to be used for 300mm wafer fabrication at the FRAUNHOFER IPMS. The systems will be used for the processing of CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. Therefore, it is necessary to fulfill require-ments regarding metal contamination and particle generation compatible with industry standards.

CPV codes

Miscellaneous general and special-purpose machinery

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Contains data from Tenders Electronic Daily (TED), © European Union, ted.europa.eu — CC BY 4.0.

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